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The double-sided packaging technology for the fingerprint ID module IC from Changjiang Electronics Technology Co., Ltd. (JCET

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The double-sided packaging technology for the fingerprint ID module IC from Changjiang Electronics Technology Co., Ltd. (JCET

The double-sided packaging technology for the fingerprint ID module IC from Changjiang Electronics Technology Co., Ltd. (JCET) was named the 9th (2014) Chins Semiconductor Industry’s Innovative Product and Technology.

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pg电子游戏(试玩)官方网站-APP下载

JCET Packaging Solutions Power AEB System Development, Safeguarding Smart Mobility

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JCET Honored with SanDisk Global “Strategic Partnership” Award

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JCET Posts Record Q3 Revenue, Profit Before Tax Up 29.3% Year-on-Year

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